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Which of the following can be used to predict the type of bonding in HCI?

Which of the following can be used to predict the type of bonding in HCI?
Take Free Practice Test On 2026 JAMB UTME, Post UTME, WAEC SSCE, GCE, NECO SSCE
  • A PH value
  • B Electronegativity difference
  • C Heat of neutralization
  • D Heat of solution
Correct Answer: Option B
Explanation:

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